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Program

(All Times Eastern Standard Time)

Day 1, May 18: Materials and Processing Challenges I

Plenary Session Chair: Tim Grotjohn (Michigan State University)

12:00-12:10 Introductions and Webinar Protocol for Questions/Attendee Interaction

12:10-12:50 Plenary 1: Defects in Wide Bandgap Semiconductors

Ania Jayich (UCSB)

12:50-1:05 Questions

1:05-1:45 Plenary 2: Si Platforms

Ravi Pillarisetty (Intel)

1:45-2:00 Questions

2:00-2:15 Break

2:15-2:55 Plenary 3: Topological Materials

Michael J. Manfra (Purdue)

2:55-3:10 Questions

3:15 Panelists Introductions and Short Summary (2 min presentations)

Panel Session Chair: Susanne Stemmer (UCSB)

Nathelie de Leon (Princeton)

Sergey Frolov (UPitt)

Matthew Rakher (HRL)

Ravi Pillarisetty (Intel)

Michael J. Manfra (Purdue)

3:30 Panel Discussion

4:45 Summary and Key Ideas

5:15 End

 

Day 2 – May 19: Materials and Processing Challenges II

Plenary Session Chair: Chris Richardson (University of Maryland)

12:00-12:10 Introductions and Webinar Protocol for Questions/Attendee Interaction

12:10-12:50 Plenary 1: Superconducting Materials and Devices

Ken Rodbell (IBM)

12:50-1:05 Questions

1:05-1:45 Plenary 2: Ion Traps                   

John Chiaverini (Lincoln Laboratory)

1:45-2:00 Questions

2:00-2:15 Break

2:15-2:55 Plenary 3: Photonic Materials and Devices                 

Kartik Srinivasan (NIST)

2:55-3:10 Questions

3:15 Panelists Introductions and Short Summary (2 min presentations)

Panel Session Chair: Doug McClure (IBM)

Panelists:

Hartmut Häffner (UC Berkeley)

Patty Lee (Honeywell)

Kevin O’Brien (MIT)

Daniel Slichter (NIST)

John Chiaverini (Lincoln Laboratory)

3:30 Panel Discussion

4:45 Summary and Key Ideas

5:15 End

 

Day 3 – May 25: Interfaces and Integration

Session Chair: Iuliana Radu (imec)

12:00-12:10 Introductions and Webinar Protocol for Questions/Attendee Interaction

12:10-12:50 Plenary 1: Photonics Integration

Pete Shadbolt (PsiQuantum)

12:50-1:05 Questions

1:05-1:45 Plenary 2:  Interlayer Dielectrics           

Josh Mutus (Rigetti)

1:45-2:00 Questions

2:00-2:15 Break

2:15-2:55 Plenary 3: 3D Integration

William Oliver (MIT)

2:55-3:10 Questions

3:15 Panelists Introductions and Short Summary (2 min presentations)

Panel Session Chair: Matthew Blain (Sandia)

Matthew Eichenfield (Sandia)

Karan Mehta (ETH)

Hong Tang (Yale)

Javad Shabani (NYU)

John Teufel (NIST)

Pete Shadbolt (PsiQuantum)

3:30 Panel Discussion

4:45 Summary and Key Ideas

5:15 End

 

Day 4 – May 26:  Scaling and Research Community Needs

Session Chair: Richard Silver (NIST)

12:00-12:10 Introductions and Webinar Protocol for Questions/Attendee Interaction

12:10-12:50 Plenary 1: Scaling

John Martinis (UCSB)

12:50-1:05 Questions

1:05-1:45 Plenary 2: Packaging and System Refrigeration Needs

Dirk Englund (MIT)

1:45-2:00 Questions

2:00-2:15 Break

2:15-2:55 Plenary 3: Facilities, Testbeds, and Benchmarking

Susan Clark (Sandia National Laboratories)

2:55-3:10 Questions

3:15 Panelists Introductions and Short Summary (2 min presentations)

Panel Session Chair: Kurt Eyink (AFRL)

Panelists:

Stefan Preble (RIT)

Jerry Chow (IBM)

Ron Walsworth (University. of Maryland)

John Martinis (UCSB)

Steven Koester (University of Minnesota)

Susan Clark (Sandia National Laboratories)

3:30 Panel Discussion

4:45 Summary and Key Ideas

5:15 End